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We are seeking quotations for the following Electroformed Bond Hub Blades: 1. Grit Type: SD Grit Size: #3000 Bond: Electroformed Concentration: 70 Exposure: 0.38-0.51 mm Kerf Width: 17.5 +/- 2.5 mm Quantity: 200 pcs/month 2. Grit Type: SD Grit Size: #2000 Bond: Electroformed Concentration: 70 Exposure: 0.51-0.64 mm Kerf Width: 22.5 +/- 2.5 mm Quantity: 100 pcs/month We look forward to receiving y
Related Keywords : dicing blade, silicon wafer, Electroformed Bond Hub BladesCategories : Manufacturing & Processing Machinery, Other Manufacturing & Processing Machinery
Japan
Hi, I am currently looking for a second source for the hubless blade that is used for sawing ceramic wafers. We're currently using Disco Diamond blade Model : P1A851 SD400R10MB01. Our machines are also from Disco. Can you pls see if you're able to match the specifications of the Disco blades and propose a suitable blade for us. Thanks Rgds Chooi
Categories : Manufacturing & Processing Machinery, Other Manufacturing & Processing Machinery
Malaysia
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