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We are seeking quotations for the following Electroformed Bond Hub Blades: 1. Grit Type: SD Grit Size: #3000 Bond: Electroformed Concentration: 70 Exposure: 0.38-0.51 mm Kerf Width: 17.5 +/- 2.5 mm Quantity: 200 pcs/month 2. Grit Type: SD Grit Size: #2000 Bond: Electroformed Concentration: 70 Exposure: 0.51-0.64 mm Kerf Width: 22.5 +/- 2.5 mm Quantity: 100 pcs/month We look forward to receiving y
Related Keywords : dicing blade, silicon wafer, Electroformed Bond Hub BladesCategories : Manufacturing & Processing Machinery, Other Manufacturing & Processing Machinery
Japan
Looking for following wafers: - pattern wafer including whole pieces and broken pieces, size for whole: 8 inch and 12 inch; - double polished wafer, size: 12 inch; - blue tape wafer; Please email me if you have those items. Thanks!
Related Keywords : Pattern wafers, Polished wafers, Broken silicon, Blue tape wafersCategories : Manufacturing & Processing Machinery, Other Manufacturing & Processing Machinery
China
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