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Semiconductor Assembly & Packaging Services

Semiconductor <strong>A</strong>ssembly & P<strong>a</strong>ck<strong>a</strong>ging Services
Standard Systems provide semiconductor packaging services to assemble die in wafer form to various package types :BGA,QFP,SO,QFN,PLCC, SOIC, PDIP, Etc...... Willing to work for Fabless and IC Design ...

Dummy QFN Lead Frame Strip with Mold Encapsulation

Dummy QFN Le<strong>a</strong>d Fr<strong>a</strong>me Strip with Mold Enc<strong>a</strong>psul<strong>a</strong>tion
Standard Systems can also build Small volume to Medium amount order after prototype. We can supply Molded Dummy QFN strips for saw blade test(QFN strips with mold encapsulation). The unit sizes are ...
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