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Sliton Ceramic PCB Is Sealed with Copper and Conductive From Top To Bottom, Forming A High-density D

Sliton Ceramic PCB Is Sealed <strong>with</strong> Copper and Conductive From Top To Bottom, Forming A High-density D
Sliton陶瓷PCB从上到下用铜密封并导电，形成高密度双面布线陶瓷电路板。 近年来，随着电子信息产业的发展，芯片正在向小型化方向发展。但由于散热量低，工作与非工作散热片温差小，传统封装材料已不能满足要求。因此，氮化铝以其优良的物理、化学、电学性能逐渐出现在人们的视线中。氪化铝陶瓷的主要材料是晶体AIN4，具有铜矿结构，属于六方晶系。 作为一种原子晶体，AlN属于类金刚石氮化物的范畴，最高可在22 ...
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