EC21, Global B2B Marketplace
Sign In
Join Free
Buy Now
Sell Now
My EC21
Help
Search Advanced Search
Suppliers > substrate > Henan Hanyin Optoelectronics Technology Co., Ltd | Matching Products
Your search for "

substrate

" found 24 companies from Henan Hanyin Optoelectronics Technology Co., Ltd, China
Inquire Now

(1-20 out of 24)

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,

AlSiC,Semiconductor Packaging <strong>Substrate</strong>,Used for Manufacturing <strong>Substrate</strong>s in Measurement Equipment,
Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan. -The low-density characteristic gives it an irreplaceable ...

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment

Used for Manufacturing <strong>Substrate</strong>s in Semiconductor Component Manufacturing and Measurement Equipment
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC

Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic <strong>Substrate</strong>,Al-SiC
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate

Electronic <strong>Substrate</strong>,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate
AlSiC was first used in the US radar chip substrate to replace tungsten copper. After the replacement, the heat dissipation effect is excellent, and the overall weight loss of the radar is 10 kg, ...

Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate

Electronic <strong>Substrate</strong>,AlSiC IGBT Base Plate,Ceramic <strong>Substrate</strong>,Heat Sinks,Al-SiC IGBT Base Plate
Aluminum Silicon Carbide IGBT Base Plate Description AlSiC was first used in the US radar chip substrate to replace tungsten copper. After the replacement, the heat dissipation effect is excellent, ...

Ceramic Substrate,Ceramic Materia,Thermal Pad,Electronic Substrat,Aluminum Silicon Carbide

Ceramic <strong>Substrate</strong>,Ceramic Materia,Thermal Pad,Electronic <strong>Substrat</strong>,Aluminum Silicon Carbide
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Ceramic Substrate,Ceramic Material,Ceramic Metallize,AlSiC,AlSiC Plate,Ceramic Plate

Ceramic <strong>Substrate</strong>,Ceramic Material,Ceramic Metallize,AlSiC,AlSiC Plate,Ceramic Plate
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Aluminum Based Silicon Carbide Electronic Substrate

Aluminum Based Silicon Carbide Electronic <strong>Substrate</strong>
Aluminum Based Silicon Carbide Electronic Substrate Description AlSiC was first used in the US radar chip substrate to replace tungsten copper. After the replacement, the heat dissipation effect is ...

Aluminum Heatsink,Aluminum Base,Thermal Substrate,Semiconductor Packaging Materials,Al-SiC,AlSiC

Aluminum Heatsink,Aluminum Base,Thermal <strong>Substrate</strong>,Semiconductor Packaging Materials,Al-SiC,AlSiC
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic <strong>Substrate</strong>,Electronic <strong>Substrat</strong>,Thermal Pad,Al-SiC
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Thermal Pad Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components,Al-SiC

Thermal Pad Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components,Al-SiC
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

AlSiC Metal Matrix Composite,Precision Component Materials,Semiconductor Component Materials,Al/SiC

AlSiC Metal Matrix Composite,Precision Component Materials,Semiconductor Component Materials,Al/SiC
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components

Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Thermal Conductive Material,Metal Matrix Composite,Al/SIC,Metal Matrix Composite Ceramic Materials

Thermal Conductive Material,Metal Matrix Composite,Al/SIC,Metal Matrix Composite Ceramic Materials
Aluminum Silicon Carbide AlSiC, a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials
Substrate Specification Silicon Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa） 270 Coefficient of Thermal ...

Aluminum Silicon Carbide IGBT Base Plate

Aluminum Silicon Carbide IGBT Base Plate
Aluminum Silicon Carbide IGBT Base Plate Description High-current IGBT (Insulated Gate Bipolar Transistor) modules generate a large amount of heat during operation. The AlSiC material is usually used ...

Thermal Pad 0.2mm AlSiC with High Thermal Conductivity for Heat Sinks and Electronic Components

Thermal Pad 0.2mm AlSiC with High Thermal Conductivity for Heat Sinks and Electronic Components
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...
Page 1 of 212Next  
Go to Page Go
Share :
Facebook
Twitter
LinkedIn
My Favorites
Email this page

Browse: Manufacturer Directory Premium Suppliers Site Map

About EC21 Contact Us Terms & Conditions Report Item Online Trading Risks Product Listing Policy

Copyright (c)1997-2026 EC21 Inc. All Rights Reserved. EC21 in KoreanChinese

Business Registry Number: 120-86-03931 | Mall order sales Registration Number: 강남-5838

Inquiry Basket ()