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Suppliers > electron > Henan Hanyin Optoelectronics Technology Co., Ltd | Matching Products
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Electronic Packaging Materials,Heat Sinks,Semiconductor Packaging & Assembly Materials,Al-SiC,AlSiC

<strong>Electron</strong>ic Packaging Materials,Heat Sinks,Semiconductor Packaging & Assembly Materials,Al-SiC,AlSiC
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

AlSi Alloy ,Al/Si Alloy,Silicon Aluminum Alloy IGBT Packing Material Electronic Packing Material

AlSi Alloy ,Al/Si Alloy,Silicon Aluminum Alloy IGBT Packing Material <strong>Electron</strong>ic Packing Material
Thermal Expansion（10-6/K） 6.0-17.5 Thermal Conductivity（W/m·K） 100-170 Features -Lightweight : Lighter than aluminum -High rigidity : 1.7times of Aluminum -Low thermal expansion : Almost equal to ...

Heat Sinks,Electronic Packaging Materials,Semiconductor Packaging & Assembly Materials,Al-SiC,Al/SiC

Heat Sinks,<strong>Electron</strong>ic Packaging Materials,Semiconductor Packaging & Assembly Materials,Al-SiC,Al/SiC
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

AlSi Alloy,Al-Si Alloy, Al/Si Alloy IGBT Packing Material Electronic Packing Material

AlSi Alloy,Al-Si Alloy, Al/Si Alloy IGBT Packing Material <strong>Electron</strong>ic Packing Material
Expansion（10-6/K） 6.0-17.5 Thermal Conductivity（W/m·K） 100-170 Features -Lightweight : Lighter than aluminum -High rigidity : 1.7times of Aluminum -Low thermal expansion : Almost equal to cast ...

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,<strong>Electron</strong>ic Substrat,Thermal Pad,Al-SiC
density and high specific rigidity -High rigidity and high strength -Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Aluminum Silicon Carbide ...

Thermal Pad Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components,Al-SiC

Thermal Pad Al/SiC with High Thermal Conductivity for Heat Sinks and <strong>Electron</strong>ic Components,Al-SiC
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC

Semiconductor Packaging & Assembly Materials,Heat Sinks,<strong>Electron</strong>ic Packaging Materials,Al-SiC,AlSiC
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, <strong>Electron</strong>ic Packaging Materials
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

Silicon Aluminum Alloy, AlSi Alloy ,Al/Si Alloy IGBT Packing Material Electronic Packing Material

Silicon Aluminum Alloy, AlSi Alloy ,Al/Si Alloy IGBT Packing Material <strong>Electron</strong>ic Packing Material
AlSi combines aluminum metal and silicon together through powder metallurgy technology. It is lighter than aluminum , has the same rigidity as cast iron, and has low thermal expansion near to ...

High-Silicon Aluminum Alloy AlSi Alloy Al/Si Alloy IGBT Packing Material Electronic Packing Material

High-Silicon Aluminum Alloy AlSi Alloy Al/Si Alloy IGBT Packing Material <strong>Electron</strong>ic Packing Material
AlSi combines aluminum metal and silicon together through powder metallurgy technology. It is lighter than aluminum , has the same rigidity as cast iron, and has low thermal expansion near to ...

Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components

Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and <strong>Electron</strong>ic Components
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate

<strong>Electron</strong>ic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate
electronic packaging, Aluminum Silicon Carbide IGBT Base Plates are irreplaceable materials due to their unique combination of high thermal conductivity, low thermal expansion coefficient, and ...

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material

Heat Sinks,Al-SiC,<strong>Electron</strong>ic Packaging Materials,Thermal Pad,Aluminum Composite Material
Machinability and Metalization Applications -Electronic component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power engineering -Renewable ...

Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate

<strong>Electron</strong>ic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate
electronic packaging, Aluminum Silicon Carbide IGBT Base Plates are irreplaceable materials due to their unique combination of high thermal conductivity, low thermal expansion coefficient, and ...

Ceramic Substrate,Ceramic Materia,Thermal Pad,Electronic Substrat,Aluminum Silicon Carbide

Ceramic Substrate,Ceramic Materia,Thermal Pad,<strong>Electron</strong>ic Substrat,Aluminum Silicon Carbide
Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for <strong>Electron</strong>ic Packaging Materials
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Thermal Pad 0.2mm AlSiC with High Thermal Conductivity for Heat Sinks and Electronic Components

Thermal Pad 0.2mm AlSiC with High Thermal Conductivity for Heat Sinks and <strong>Electron</strong>ic Components
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Aluminum Based Silicon Carbide Electronic Substrate

Aluminum Based Silicon Carbide <strong>Electron</strong>ic Substrate
Aluminum Based Silicon Carbide Electronic Substrate Description AlSiC was first used in the US radar chip substrate to replace tungsten copper. After the replacement, the heat dissipation effect is ...

Metal Matrix Composite Ceramic Materials ,Semiconductor Material,Alumina Ceramic,AlSiC,Al-SiC,Al/SiC

Metal Matrix Composite Ceramic Materials ,Semiconductor Material,Alumina Ceramic,AlSiC,Al-SiC,Al/SiC
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Precision Structural Components,Silicon Carbide Structural Parts,Wear Resistance Parts,AlSiC,Al-SiC

Precision Structural Components,Silicon Carbide Structural Parts,Wear Resistance Parts,AlSiC,Al-SiC
Electronics: Heat sinks, housings, and thermal management systems. Industrial Equipment: High-strength and wear-resistant machinery components. Q2: What are the key properties of Al-SiC Structural ...
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