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Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC

Thermal Conductive Material,Alumina <strong>Ceramic</strong>,Thermal Pad,Customized <strong>Ceramic</strong> <strong>Substrate</strong>,Al-SiC
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate

Electronic <strong>Substrate</strong>,AlSiC IGBT Base Plate,<strong>Ceramic</strong> <strong>Substrate</strong>,Heat Sinks,Al-SiC  IGBT Base Plate
Aluminum Silicon Carbide IGBT Base Plate Description AlSiC was first used in the US radar chip substrate to replace tungsten copper. After the replacement, the heat dissipation effect is excellent, ...

Ceramic Substrate,Ceramic Materia,Thermal Pad,Electronic Substrat,Aluminum Silicon Carbide

<strong>Ceramic</strong> <strong>Substrate</strong>,<strong>Ceramic</strong> Materia,Thermal Pad,Electronic <strong>Substrat</strong>,Aluminum Silicon Carbide
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Ceramic Substrate,Ceramic Material,Ceramic Metallize,AlSiC,AlSiC Plate,Ceramic Plate

<strong>Ceramic</strong> <strong>Substrate</strong>,<strong>Ceramic</strong> Material,<strong>Ceramic</strong> Metallize,AlSiC,AlSiC Plate,<strong>Ceramic</strong> Plate
Aluminum Silicon Carbide(AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC

Aluminum Heatsink,Aluminum Base,Aluminum <strong>Ceramic</strong> <strong>Substrate</strong>,Electronic <strong>Substrat</strong>,Thermal Pad,Al-SiC
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Thermal Pad Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components,Al-SiC

Thermal Pad  Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components,Al-SiC
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC
Aluminum Silicon Carbide(AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials
Aluminum Silicon Carbide(AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

AlSiC Metal Matrix Composite,Precision Component Materials,Semiconductor Component Materials,Al/SiC

AlSiC Metal Matrix Composite,Precision Component Materials,Semiconductor Component Materials,Al/SiC
Aluminum Silicon Carbide(AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components

Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate

Electronic <strong>Substrate</strong>,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate
AlSiC was first used in the US radar chip substrate to replace tungsten copper. After the replacement, the heat dissipation effect is excellent, and the overall weight loss of the radar is 10 kg, ...

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Thermal Conductive Material,Metal Matrix Composite,Al/SIC,Metal Matrix Composite Ceramic Materials

Thermal Conductive Material,Metal Matrix Composite,Al/SIC,Metal Matrix Composite <strong>Ceramic</strong> Materials
Aluminum Silicon Carbide AlSiC, a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials
ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional Metal Matrix Composites, AlSiC ...

Thermal Pad 0.2mm AlSiC with High Thermal Conductivity for Heat Sinks and Electronic Components

Thermal Pad 0.2mm AlSiC with High Thermal Conductivity for Heat Sinks and Electronic Components
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Aluminum Silicon Carbide,AlSiC Is A High-strength and High Thermal Conductivity Ceramic Material

Aluminum Silicon Carbide,AlSiC  Is A High-strength and High Thermal Conductivity <strong>Ceramic</strong> Material
ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional Metal Matrix Composites, AlSiC ...

Aluminum Based Silicon Carbide Electronic Substrate

Aluminum Based Silicon Carbide Electronic <strong>Substrate</strong>
Aluminum Based Silicon Carbide Electronic Substrate Description AlSiC was first used in the US radar chip substrate to replace tungsten copper. After the replacement, the heat dissipation effect is ...

Aluminum Metal Matrix Composites for Lighter Weight Designs

Aluminum Metal Matrix Composites for Lighter Weight Designs
AlSiC, a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional Metal Matrix Composites, ...

Electronic Packaging Materials,Heat Sinks,Semiconductor Packaging & Assembly Materials,Al-SiC,AlSiC

Electronic Packaging Materials,Heat Sinks,Semiconductor Packaging & Assembly Materials,Al-SiC,AlSiC
Aluminum Silicon Carbide(AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Aluminum Heatsink,Aluminum Base,Thermal Substrate,Semiconductor Packaging Materials,Al-SiC,AlSiC

Aluminum Heatsink,Aluminum Base,Thermal <strong>Substrate</strong>,Semiconductor Packaging Materials,Al-SiC,AlSiC
Aluminum Silicon Carbide(AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...
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