Search Advanced Search
Suppliers > with > Hothree Technology | Matching Products
Your search for "

with

" found 9 companies from Hothree Technology, China

(1-9 out of 9)

Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0

Bergquist Gap Pad HC5.0  GAP PADTGP HC5000 BERGQUIST GPHC5.0
BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal ...

Bergquist Sil Pad Tsp Q2500 BERGQUIST Q PAD II

Bergquist Sil Pad Tsp Q2500 BERGQUIST Q PAD II
BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil-coated on both sides with thermally and electricallyconductive SIL PAD rubber. The material is designed for those applications in which ...

Loctite 315

Loctite 315
Technology:AcrylicChemical Type:AcrylicAppearance (uncured):Blue pasteComponents:One component - requires no mixingViscosity:HighCure:ActivatorApplication:Bonding Henkel LOCTITE 315 300ML is a ...

Bergquist Gap Filler Tgf 2000 GF2000

Bergquist Gap Filler Tgf 2000 GF2000
with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease. After cure, it won’t pump from the interface as a result of thermal cycling and is dry to the touch. Unlike ...

Bergquist Hi Flow Thf 500 Hi-Flow 625

Bergquist Hi Flow Thf 500 Hi-Flow 625
of the coating material eliminates shipping and handling problems. The PEN film has a continuous use temperature of 150°C.HI FLOW THF 500 is tack-free and scratch-resistant at production temperature ...

Bergquist Gap Pad Tgp 7000ulm

Bergquist Gap Pad Tgp 7000ulm
FEATURES AND BENEFITS 1.Thermal Conductivity: 7 W/m-K 2.High-compliance, low compression stress 3.Ultra low modulus PRODUCT DESCRIPTIONA 7 W/m-K, extremely soft Gap Pad with exceptional thermal ...

Bergquist SP900S Sil Pad 900s SIL PAD TSP 1600S

Bergquist SP900S Sil Pad 900s  SIL PAD TSP 1600S
The true workhorse of the SIL PAD product family, SIL PAD900S AC (BERGQUIST SP900S AC)thermally conductive insulation material is designed for a wide variety of applications requiring high thermal ...

BERGQUIST Q-Pad 3 SIL PAD TSP Q2000

BERGQUIST Q-Pad 3  SIL PAD TSP Q2000
BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solderbaths. SIL PAD TSP Q2000 may be installed prior to soldering and ...

Laird Tflex 600 Thermal Gap Filler

Laird Tflex 600 Thermal Gap Filler
FEATURES AND BENEFITS • Very high compliancy for low stress applications • 3 W/mK thermal conductivity • Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm) • Naturally tacky, needs no ...
Page 1 of 11
Go to Page Go

Browse: Manufacturer Directory Premium Suppliers Site Map

About EC21 Contact Us Terms & Conditions Report Item Online Trading Risks Product Listing Policy

Copyright (c)1997-2026 EC21 Inc. All Rights Reserved. EC21 in KoreanChinese

Business Registry Number: 120-86-03931 | Mall order sales Registration Number: 강남-5838

Inquiry Basket ()