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Suppliers > divider > SunWin HuBei Optoelectronic Technology Co.,Ltd | Matching Products
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Capacitive Fingerprint Module On the Back of the Phone

Capacitive Fingerprint Module On the Back of the Phone
Structure: Coating Package size: 10 thickness 0.65mm Induction type: capacitance principle press type Sensing area: 6.0*6.0 Cold screen unlock: <0.15S Pixel array: 120*120 Dividing rate: ...
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