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Date Posted :
2009-03-18
Valid Until :
2010-03-18
We wish get pcb order from any customer!
Process technical capacity:
Material: FR-4, High TG, CEM-3, Teflon
Later: 2-18 layers
PCB thickness: 6-120mil
Trace width/Space: ≥3 mils
Hole: ≥8 mils，buried and blind via; OR: Laser buried and blind hole=4mil
Pad surface: Plating Ni/Au, Immersion Ni/Au, Sn，OSP，Pb/Sn
Solder mask: LPI Mask (colors: Green, Red, Blue, or Black)，Can to peel mask
Gold thickness: 2-50μ″
Impedance controlled ：50-100 +/-10% Ohms
O/S Test: AOI inner-layer，E-TEST，Fly-probe test,
Outline: CNC, Punch, V-CUT
Related Keywords : PCB Order, PCB, Printed Circuit Boards, Circuit board
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