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Date Posted :
2012-05-31
Valid Until :
2012-06-30
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I need some prototype samples assembled in a 12, 14 or 16 lead SOIC open cavity package.
The die size is 1375um x 1400um and has 20 bond pads (12 power and GND pads). The bond pads are 72um x 116um. The die only has 9 different functional pins in total.
I am interested in an initial run of 300-500 pieces.
I would also need to source the package type most suited for this assembly.
I can provide further detail if required.
Related Keywords : IC Assembly, Wafer Probe
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