24 Mar, 2026 on three key platform technologies - Wire Bond, Flip Chip, and a differentiated offering called Integrated Systems Packaging (ISP), with plans of expanding the roadmap to advanced packaging technologies in the future.
These technologies are extremely critical for key applications in India – like automotive (especially electric vehicles), communications, network infrastructure and others.
This buyer would like to receive quotations from Premium Members only.
Related Keywords : Semiconductor PartsCategories : Electronic Components & Supplies, Semiconductors