- Buyer Country
-
- India (2)
- Search Options
- Subscription
- Trade Alert
Notify me of new technology & communication info. - RSS Feeds
- My Recent History
on three key platform technologies - Wire Bond, Flip Chip, and a differentiated offering called Integrated Systems Packaging (ISP), with plans of expanding the roadmap to advanced packaging technologies in the future. These technologies are extremely critical for key applications in India – like automotive (especially electric vehicles), communications, network infrastructure and others.
This buyer would like to receive quotations from Premium Members only.
Related Keywords : Semiconductor MachineryCategories : Electronic Components & Supplies, Semiconductors
India
on three key platform technologies - Wire Bond, Flip Chip, and a differentiated offering called Integrated Systems Packaging (ISP), with plans of expanding the roadmap to advanced packaging technologies in the future. These technologies are extremely critical for key applications in India – like automotive (especially electric vehicles), communications, network infrastructure and others.
This buyer would like to receive quotations from Premium Members only.
Related Keywords : Semiconductor PartsCategories : Electronic Components & Supplies, Semiconductors
India
Need more Buyer data?
Find quality technology & communication buyers in our Global Buyer Directory![Archive Search]Find archives of "technology & communication" in "Semiconductors" Buying Leads Category BEFORE January 1st, 2015.
Competitive technology & communication products from various technology & communication manufacturers and technology & communication suppliers are listed above, please select quality and cheap items for you.
Recommended Content
![]() |