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We’re looking for Korean suppliers of equipment parts for semiconductor manufacturing. The required parts fall under HSN Code 8479 and will be used in high-precision packaging processes including Wire Bond, Flip Chip, and Integrated Systems Packaging (ISP). We welcome proposals from manufacturers with proven experience and global supply capabilities.
This buyer would like to receive quotations from Premium Members only.
Related Keywords : Semiconductor, Semiconductor Equipment PartsCategories : Electronic Components & Supplies, Semiconductors
India
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Find quality packaged under buyers in our Global Buyer Directory![Archive Search]Find archives of "packaged under" in "Semiconductors" Buying Leads Category BEFORE January 1st, 2015.
Competitive packaged under products from various packaged under manufacturers and packaged under suppliers are listed above, please select quality and cheap items for you.
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