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This is greg from Semicon Device Co. Ltd in South Korea We need Quotation for Wafer having under specification. 1. Diameter : 6", Flat zone (55~57mm: JEDEC) 2. Growing Method : FZ 3. Doping Method : NTD 4. Thickness : 1050 +- 50um 5. Resistivity : 410 +- 30Ohm-cm 6. Polishing : DSP(Double Side Polishing) or SSP 7. Orientation : <111> or <100> 8. Quantity : 25 or 50 9. Requirement Delivery : 3
Categories : Chemicals, Other Inorganic Chemicals
Korea
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