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Hi, I am currently looking for a second source for the hubless blade that is used for sawing ceramic wafers. We're currently using Disco Diamond blade Model : P1A851 SD400R10MB01. Our machines are also from Disco. Can you pls see if you're able to match the specifications of the Disco blades and propose a suitable blade for us. Thanks Rgds Chooi
Categories : Manufacturing & Processing Machinery, Other Manufacturing & Processing Machinery
Malaysia
Hi, my name is Chew KK. I am from New Productor Development Department, Renesas Semiconductor (Malaysia). Our group is interested on this Wafer Ring Carrier Box product of your company to handle our wafer after dicing. Thus, I would like to request from your company to send us a catalog about this product. Thank you.
Categories : Electronic Components & Supplies, Other Electronic Components
Malaysia
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