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We wish get pcb order from any customer! Process technical capacity: Material: FR-4, High TG, CEM-3, Teflon Later: 2-18 layers PCB thickness: 6-120mil Trace width/Space: ≥3 mils Hole: ≥8 mils,buried and blind via; OR: Laser buried and blind hole=4mil Pad surface: Plating Ni/Au, Immersion Ni/Au, Sn,OSP,Pb/Sn Solder mask: LPI Mask (colors: Green, Red, Blue, or Black),Can to peel mask Gold thickness: 2-50μ″ Impedance controlled :50-100 +/-10% Ohms O/S Test: AOI inner-layer,E-TEST,Fly-probe test, Outline: CNC, Punch, V-CUT |
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